Thermal Conductive RF Absorber Pad

LiPOLY’s TEM series is a composite gap filler material with the functions of heat conduction and electromagnetic wave absorption. Thermal conductivity: 2.0~4.0 W/m*K for application frequency range 10MHz-77GHz.  It has features of high flexibility and high compressibility.  Customized die-cut and shape molding are all available.  Shiu Li has professional research and development capabilities which can provide cutting-edge thermal solutions immediately to meet all customers’ need for today’s advanced products.

5G mmWave Thermal Conductive Gel Pad

LiPOLY’s DTT series is specially designed for network communication signal transmission. It focuses on Dk and Df to reduce interference in RF modules. Thermal conductivity: 3.0-5.0 W / m*K.  Hardness Shore OO/50-55 not only provides flexibility, compressibility, insulation, good self-adhesiveness, also can remove tolerances of the mechanism design.  We provide customized die-cut and shape molding.

Shiu Li has professional research and development capabilities which can provide cutting-edge thermal solutions immediately to meet all customers’ need for today’s advanced products.

Do you have some questions? Please don’t hesitate to send us an email:service_us@lipoly.com