High Thermally Conductive Gap Filler

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by lipolytim

LiPOLY T-work9000

LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.

Silicone pad thermal interface material - T-work9000

Datasheet

Features

  • Thermal conductivity: 20.0 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

LiPOLY T-work8000

LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an efficient and consistent transfer of heat. T-work8000 is designed for the most demanding of applications.

Datasheet

Features

  • Thermal conductivity: 15.0 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

LiPOLY T-work7000

Our high thermally conductive gap filler T-work7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink.

Datasheet

Features

  • Thermal conductivity: 11.0 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

LiPOLY T-top81

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81 offers excellent performance at an extremely competitive price.

Datasheet

Features

  • Thermal conductivity: 8.0 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • High deflection material
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

Do you have some questions? Please don’t hesitate to send us an email: projects@lipolytim.com