High Thermally Conductive Gap Pad: T-Top 800

LiPOLY T-Top 800 is an ultra-soft, highly conformable, non-flammable interface material. T-Top 800 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-Top 800 offers excellent performance at an extremely competitive price.

Features

  • Thermal conductivity: 8.0 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • High deflection material
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

High Thermally Conductive Gap Pad: T-Pad 900

LiPOLY T-Pad 900 is an ultra-soft, highly conformable, non-flammable interface material. T-Pad 900 is designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 9.0 W/m*K, T-Pad 900 offers excellent performance at an extremely competitive price.

Features

  • Thermal conductivity: 9.0 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

High Thermally Conductive Gap Filler: T-Work 7000

Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink, shielding metals.

Features

  • Thermal conductivity: 11 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

High Thermally Conductive Gap Filler: T-Work 8000

Features

  • Thermal conductivity: 15 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

Do you have some questions? Please don’t hesitate to send us an email: projects@lipolytim.com