Highly Thermally Conductive Gap Filler

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by lipolytim

LiPOLY T-top800

LiPOLY T-top800 is an ultra-soft, highly conformable, non-flammable interface material. T-top800 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top800 offers excellent performance at an extremely competitive price.

Thermally Conductive Gap Filler

Datasheet

Features

  • Thermal conductivity: 8.0 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • High deflection material
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

LiPOLY T-pad900

LiPOLY T-pad900 is an ultra-soft, highly conformable, non-flammable interface material. T-pad900 is designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 9.0 W/m*K, T-pad900 offers excellent performance at an extremely competitive price.

Thermally Conductive Gap Filler

Datasheet

Features

  • Thermal conductivity: 9.0 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

LiPOLY T-work7000

Our high thermally conductive gap filler T-work7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink.

lipoly thermal conductive gap filler

Datasheet

Features

  • Thermal conductivity: 11 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

LiPOLY T-work8000

thermal conductive gap filler- thermal solutions

Datasheet

Features

  • Thermal conductivity: 15 W/m*K
  • Highly conformable
  • Ultra-soft
  • High thermal conductivity
  • Non-flammable interface material.
  • It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

  • Between CPU and heat sink.
  • Between a component and heat sink.
  • Flat-panel displays
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

Do you have some questions? Please don’t hesitate to send us an email: projects@lipolytim.com