LiPOLY T-work9000
LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
Features
- Thermal conductivity: 20.0 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
LiPOLY T-work8000
LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an efficient and consistent transfer of heat. T-work8000 is designed for the most demanding of applications.
Features
- Thermal conductivity: 15.0 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
LiPOLY T-work7000
Our high thermally conductive gap filler T-work7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink.
Features
- Thermal conductivity: 11.0 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
LiPOLY T-pad900
LiPOLY T-pad900 is an ultra-soft, highly conformable, non-flammable interface material. T-pad900 is designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 9.0 W/m*K, T-pad900 offers excellent performance at an extremely competitive price.
Features
- Thermal conductivity: 9.0 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
LiPOLY T-top800
LiPOLY T-top800 is an ultra-soft, highly conformable, non-flammable interface material. T-top800 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top800 offers excellent performance at an extremely competitive price.
Features
- Thermal conductivity: 8.0 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- High deflection material
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
Do you have some questions? Please don’t hesitate to send us an email: projects@lipolytim.com