High Thermally Conductive Gap Pad: T-Top 800
LiPOLY T-Top 800 is an ultra-soft, highly conformable, non-flammable interface material. T-Top 800 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-Top 800 offers excellent performance at an extremely competitive price.
Features
- Thermal conductivity: 8.0 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- High deflection material
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
High Thermally Conductive Gap Pad: T-Pad 900
LiPOLY T-Pad 900 is an ultra-soft, highly conformable, non-flammable interface material. T-Pad 900 is designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 9.0 W/m*K, T-Pad 900 offers excellent performance at an extremely competitive price.
Features
- Thermal conductivity: 9.0 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
High Thermally Conductive Gap Filler: T-Work 7000
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink, shielding metals.
Features
- Thermal conductivity: 11 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
High Thermally Conductive Gap Filler: T-Work 8000
Features
- Thermal conductivity: 15 W/m*K
- Highly conformable
- Ultra-soft
- High thermal conductivity
- Non-flammable interface material.
- It is excellent for filling small air gaps, making reliable contact with heat source & sink
Applications
- Between CPU and heat sink.
- Between a component and heat sink.
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
Do you have some questions? Please don’t hesitate to send us an email: projects@lipolytim.com