Thermally Conductive S-Putty
Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 3.5 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with overflow and solve drying problems to increase the thermal conductivity. S-Putty is a great alternative to thermal grease in design gaps under 1.0mm (0.2mm~0.5mm). We highly recommend pairing it with the S-Putty Dispensing Robot.
Features
- Thermal conductivity: 3.5 W/m*K
- Tolerance filled
- High compressibility with low stress
- No vertical flow
- High reliability
- Bond Line Thickness: 100-1500μm
Applications
- Notebook computers
- Heat pipe assemblies
- TV hardware
- Wireless communication hardware
- High-speed mass storage drives
- Set-top box
- IP CAM
Thermally Conductive H-Putty
Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the H-putty series is 3.5 W/m*K.
Features
- Thermal conductivity: 3.5 W/m*K
- Tolerance filled
- High compressibility with low stress
- No vertical flow
- High reliability
- Bond Line Thickness: 100-3000μm
Applications
- Notebook computers
- Heat pipe assemblies
- TV hardware
- Wireless communication hardware
- High-speed mass storage drives
- Set-top box
- IP CAM
Thermally Conductive H-Putty2
Thermal Conductive Putty | LiPOLY H-putty2 is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty2 can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty2 has a bond line thickness of 100-3000μm. The thermal conductivity of the H-putty2 series is 6.0 W/m*K.
Features
- Thermal conductivity: 6.0 W/m*K
- Tolerance filled
- High compressibility with low stress
- No vertical flow
- High reliability
- Bond Line Thickness: 100-3000μm
Applications
- Notebook computers
- Heat pipe assemblies
- TV hardware
- Wireless communication hardware
- High-speed mass storage drives
- Set-top box
- IP CAM
Thermally Conductive SH-putty3
Thermal Conductive Putty | LiPOLY SH-putty3 is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our SH-putty3 can replace thermals pads in design gaps of 0.1mm-3.0mm. SH-putty3 has a bond line thickness of 100-3000μm. The thermal conductivity of the SH-putty3 series is 8.0 W/m*K.
Features
- Thermal conductivity: 8.0 W/m*K
- Tolerance filled
- High compressibility with low stress
- No vertical flow
- High reliability
- Bond Line Thickness: 100-3000μm
Applications
- Notebook computers
- Heat pipe assemblies
- TV hardware
- Wireless communication hardware
- High-speed mass storage drives
- Set-top box
- IP CAM
Thermally Conductive N-putty
Thermal Conductive N-Putty | LiPOLY N-putty is a silicone free tolerance filled, thermally conductive non-silicone putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our N-putty can replace thermals pads in design gaps of 0.1mm-1.0mm. N-putty has a bond line thickness of 100-1000μm. The thermal conductivity of the N-putty series is 3.5 W/m*K.
Features
- Thermal conductivity: 3.5 W/m*K
- Silicone free/tolerance filled
- High compressibility with low stress
- No vertical flow
- High reliability
- Bond Line Thickness: 100-1000μm
Applications
- Notebook computers
- Optical application
- LED/TV hardware
- Wireless communication hardware
- High-speed mass storage drives
- Set-top box
- IP CAM
Thermally Conductive N-putty2
Thermal Conductive N-Putty2 | LiPOLY N-putty2 is a silicone free tolerance filled, thermally conductive non-silicone putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our N-putty2 can replace thermals pads in design gaps of 0.1mm-1.0mm. N-putty2 has a bond line thickness of 100-1000μm. The thermal conductivity of the N-putty2 series is 5.0 W/m*K.
Features
- Thermal conductivity: 5.0 W/m*K
- Silicone free/tolerance filled
- High compressibility with low stress
- No vertical flow
- High reliability
- Bond Line Thickness: 100-1000μm
Applications
- Notebook computers
- Optical application
- LED/TV hardware
- Wireless communication hardware
- High-speed mass storage drives
- Set-top box
- IP CAM
Do you have some questions? Please don’t hesitate to send us an email: projects@lipolytim.com