Thermal Conductive Gel Pad: DTT44 5G mmWave
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.
Features
- Thermal conductivity: 3.0 W/m*K
- Hardness: Shore 00/50
- Low dielectric constant
- For high-frequency applications
- Available in a range of thicknesses
Applications
- 5G system devices
- Communications Satellite (CS) hardware
- Satellite positioning devices
- IoT devices
- Telecommunication hardware
Thermal Conductive Gel Pad: DTT65 5G mmWave
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.
Features
- Thermal conductivity: 5.0 W/m*K
- Hardness: Shore 00/60
- Low dielectric constant
- For high-frequency applications
- Available in a range of thicknesses
Applications
- 5G system devices
- Communications Satellite (CS) hardware
- Satellite positioning devices
- IoT devices
- Telecommunication hardware
Thermal Conductive Absorber Pad: TEM96A
Features
- Thermal conductivity: 2.0 W/m*K
- Soft and high resilience
- Hardness: Shore 00/40
- Naturally tacky
- Easy to assemble
- Good insulator
Applications
- IC, CPU, MOS, LED, M/B, P/S, Heatsink
- LCD-TV
- Notebook PC
- Telecom Device
- Wireless Hub
- DDR II Module, DVD Applications
- Handset applications
Thermal Conductive Absorber Pad: TEM96B
Features
- Thermal conductivity: 3.0 W/m*K
- Soft and high resilience
- Hardness: Shore 00/45
- Naturally tacky
- Easy to assemble
- Good insulator
Applications
- IC, CPU, MOS, LED, M/B, P/S, Heatsink
- LCD-TV
- Notebook PC
- Telecom Device
- Wireless Hub
- DDR II Module, DVD Applications
- Handset applications
Thermal Conductive Absorber Pad: TEM96C
Features
- Thermal conductivity: 4.0 W/m*K
- Soft and high resilience
- Hardness: Shore 00/55
- Naturally tacky
- Easy to assemble
- Good insulator
Applications
- IC, CPU, MOS, LED, M/B, P/S, Heatsink
- LCD-TV
- Notebook PC
- Telecom Device
- Wireless Hub
- DDR II Module, DVD Applications
- Handset applications
Absorber Pad: AEM83
LiPOLY AEM83 is an absorber pad, which is made of soft magnetic material and polymer resin. It can transfer electromagnetic radiation to thermal energy and lose it quickly.
Features
- Soft and high resilience
- Naturally tacky
- Easy to assemble
- Good insulator
Applications
- IC, CPU, MOS, LED, M/B, P/S, Heatsink
- LCD-TV
- Notebook PC
- Telecom Device
- Wireless Hub
- DDR II Module, DVD Applications
- Handset applications
Any questions? Please don’t hesitate to send us an email: projects@lipolytim.com