Thermal Conductive Pad: LiPOLY PK223 Gel

LiPOLY’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.

Features

  • Thermal conductivity: 2.0W/m*K
  • Naturally tacky and high resilience
  • High reliability
  • Easy to assemble
  • Super soft and high compressibility

Applications

  • Notebook computer
  • Heat pipe assemblies
  • Memory modules
  • TV hardware
  • Automotive Electronics
  • Mobile devices
  • High-speed storage drives
  • Set-top-box
  • IP Cam

 Thermal Conductive Pad: LiPOLY PK404 Gel

LiPOLY’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.

Features

  • Thermal conductivity: 4.0W/m*K
  • Naturally tacky and high resilience
  • High reliability
  • Easy to assemble
  • Super soft and high compressibility

Applications

  • Notebook computers
  • Heat pipe assemblies
  • Memory modules
  • TV hardware
  • Automotive Electronics
  • Mobile devices
  •  High-speed storage drives
  • Set-top-box
  • IP Cam

Thermal Conductive Pad: LiPOLY PK605 Gel

LiPOLY’s PK605 is a material designed for gap filling. The thermal conductivity is 6.0W/m*K. The hardness is Shore 00/60 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.

Features

  • Thermal conductivity: 6.0W/m*K
  • Naturally tacky and high resilience
  • High reliability
  • Easy to assemble
  • Super soft and high compressibility

Applications

  • Notebook computers
  • Heat pipe assemblies
  • Memory modules
  • TV hardware
  • Automotive Electronics
  • Mobile devices
  •  High-speed storage drives
  • Set-top-box
  • IP Cam

 Thermal Conductive Pad: LiPOLY PK700 Gel

LiPOLY’s PK700 is a material designed for gap filling. The thermal conductivity is 700 W/m*K. The hardness is Shore 00/55 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.

Features

  • Thermal conductivity: 7.0W/m*K
  • Naturally tacky and high resilience
  • High reliability
  • Easy to assemble
  • Naturally tacky
  • High resilience

Applications

  • Notebook computers
  • Heat pipe assemblies
  • Memory modules
  • TV hardware
  • Automotive Electronics
  • Mobile devices
  •  High-speed storage drives
  • Set-top-box
  • IP Cam

Thermal Conductive Pad: LiPOLY S282 Pad

LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped vibration, and shock absorption is an outstanding electric insulating material.

Features

  • Thermal conductivity: 1.07W/m*K
  • Shock and vibrating absorber
  • High reliability
  • Easy to assemble
  • High strength

Applications

  • Between component and heat sink
  • Heat pipe assemblies
  • Memory modules
  • Flat-panel display
  • LED
  • Mobile devices
  • Power supplies
  • Set-top-box
  • IP Cam

Thermal Conductive Pad: LiPOLY S393 Pad

LiPOLY’s S393 is a thermally conductive pad for gap filling. The thermal conductivity is 2.2W/m*K. The material has great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped vibration, and shock absorption is an outstanding electric insulating material.

Features

  • Thermal conductivity: 2.2W/m*K
  • Shock and vibrating absorber
  • High reliability
  • Easy to assemble

Applications

  • Between component and heat sink
  • Heat pipe assemblies
  • Memory modules
  • Flat-panel display
  • LED
  • Mobile devices
  • Power supplies
  • Set-top-box
  • IP Cam

Thermal Conductive Pad: LiPOLY S818 Pad

LiPOLY’s S818 is a thermally conductive pad designed for gap filling. The thermal conductivity is 3.2 /5 W/m*K. The material has great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped vibration, and shock absorption is an outstanding electric insulating material.

Features

  • Thermal conductivity: 3.2/5 W/m*K
  • Shock and vibrating absorber
  • High reliability
  • Easy to assemble

Applications

  • Between component and heat sink
  • Heat pipe assemblies
  • Memory modules
  • Flat-panel display
  • LED
  • Mobile devices
  • Power supplies
  • Set-top-box
  • IP Cam

Any questions? Please don’t hesitate to send us an email: projects@lipolytim.com