TPS587/588/589 Thermal Conductive Sealing

Features

  • Thermal conductivity: 2.0/1.5/0.8 W/m*K
  • Two-part package and easy to use
  • Waterproof and air-tight
  • Vibration dampening

Applications

  • Automotive electronics
  • Telecommunications
  • Computer and peripherals
  • Between any heat generating component and heatsink

EPDM30 Two-Part Thermally Conductive Epoxy

Features

  • Thermal conductivity: 3.0 W/m*K
  • Epoxy based material with high hardness for support
  • Two-part package and easy to use with dispenser
  • Room Temperature curing or heating curing
  • Excellent adhesion to metal and PCB

Applications

  • Automotive electronics
  • Telecommunications
  • Computer and peripherals
  • Between any heat generating component and heatsink

EP770 Two-Part Thermally Conductive Epoxy

Features

  • Thermal conductivity: 2.5 W/m*K
  • Low viscosity and Flowability
  • Epoxy based material with high hardness for support
  • Can be applied with dispenser
  • RoomTemperature or heating curing

Applications

  • Automotive electronics
  • Telecommunications
  • Computer and peripherals
  • Between any heat generating component and heatsink