TPS587/588/589 Thermal Conductive Sealing
Features
- Thermal conductivity: 2.0/1.5/0.8 W/m*K
- Two-part package and easy to use
- Waterproof and air-tight
- Vibration dampening
Applications
- Automotive electronics
- Telecommunications
- Computer and peripherals
- Between any heat generating component and heatsink
EPDM30 Two-Part Thermally Conductive Epoxy
Features
- Thermal conductivity: 3.0 W/m*K
- Epoxy based material with high hardness for support
- Two-part package and easy to use with dispenser
- Room Temperature curing or heating curing
- Excellent adhesion to metal and PCB
Applications
- Automotive electronics
- Telecommunications
- Computer and peripherals
- Between any heat generating component and heatsink
EP770 Two-Part Thermally Conductive Epoxy
Features
- Thermal conductivity: 2.5 W/m*K
- Low viscosity and Flowability
- Epoxy based material with high hardness for support
- Can be applied with dispenser
- RoomTemperature or heating curing
Applications
- Automotive electronics
- Telecommunications
- Computer and peripherals
- Between any heat generating component and heatsink