PK404DM Fast Curing Thermal Gel
Features
- Thermal conductivity: 3.5 W/m*K
- Fast curing in normal atmospheric temperatures
- Flame retardant
- Great reliability
- Great sealing in low-pressure applications
Applications
- Between CPU and heatsink
- Between any component and heatsink
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
PK605DM Fast Curing Thermal Gel
Features
- Thermal conductivity: 5.0 W/m*K
- Fast curing in normal atmospheric temperatures
- Flame retardant
- Great reliability
- Great sealing in low-pressure applications
Applications
- Between CPU and heatsink
- Between any component and heatsink
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
TPS587/588/589 Thermal Conductive Grease
Features
- Thermal conductivity: 2.0/1.5/0.8 W/m*K
- Two-part package and easy to use
- Waterproof and air-tight
- Vibration dampening
Applications
- Automotive electronics
- Telecommunications
- Computer and peripherals
- Between any heat generating component and heatsink
Any questions? Please don’t hesitate to send us an email: projects@lipolytim.com