Nano-Thermal Interface Grease: TT3000

LiPOLY TT3000 is a Nano type thermal interface material based on a unique formula. TT3000 is a highly reliable thermal grease made of Non-Solvent silicone oil compounds and thermal fillers. TT3000 provides superior performance and reliability while mitigating against pump-out and floating issues on the interface. TT3000 has improved the operating process while simultaneously providing high thermal conductivity and excellent low thermal resistance, improving the components performance as well as the product lifecycle.

Features

  • Thermal conductivity: 6.0 W/m*K
  • Low thermal impedance
  • Stable and homogeneous compound to ensure thermal performance
  • Formula can fill gaps at low pressure
  • High stability and reliability
  • Solvent-free formula
  • The product is qualified for RoHS and REACH

Applications

  • CPU, ICs and chip coolers
  • Power transistors and switching power supplies
  • Between any heat generating component and heatsink

Thermal Interface Grease: G3380

LiPOLY’s G3380 thermal interface grease has low thermal resistance and great thermal conductivity. G3380 has been used extensively in Consumer electronics and Microprocessors for their thermal control techniques. The grease can cover several coats on the component interface. When the component’s temperature rises, the grease stickiness will decrease, which can moisten the interface components.

Features

  • Thermal conductivity: 1.3 / 3.2 / 4.5 /6.0 W/m*K
  • Low thermal impedance

Applications

  • CPU and chip coolers
  • Switching power supplies
  • LED appliances
  • Between any heat generating component and heatsink

Thermal Interface Grease: G338N Non-silicone

Non-Silicone thermal grease G3380N is made of non-silicon resin material. G3380N has low-molecular-weight siloxanes, non-volatile, low thermal resistance, great thermal conductivity, and has been used extensively in consumer electronics and microprocessors for their thermal control techniques. G3380N can cover several coats on the component interface. When the component’s temperature rises, the thermal interface grease stickiness will decrease, which can moisten the interface components.

Features

  • Thermal conductivity: 1.3 / 3.2 / 4.5 W/m*K
  • No low MW siloxane
  • Low thermal impedance

Applications

  • CPU and chip coolers
  • Switching power supplies
  • LED appliances
  • Between any heat generating component and heatsink

Do you have some questions? Please don’t hesitate to send us an email: projects@lipolytim.com