Thermally Conductive N-Putty

Thermal Conductive Putty | LiPOLY N-putty is a silicone- free thermally conductive putty that is great for filling small air gaps. The thermal conductivity is 3.5 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with overflow and solve drying problems to increase the thermal conductivity. N-Putty is a great alternative to thermal grease in design gaps under 1.0mm (0.2mm~0.5mm). We highly recommend pairing it with the N-Putty Dispensing Robot.

Features

  • Thermal conductivity: 3.5 W/m*K
  • Silicone free/tolerance filled
  • High compressibility with low stress
  • No vertical flow
  • High reliability
  • Bond Line Thickness: 100-1000μm

Applications

  • Notebook computers
  • Optical application
  • LED/TV hardware
  • Wireless communication hardware
  • High-speed mass storage drives
  • Set-top box
  • IP CAM

Thermally Conductive N-putty2

Thermal Conductive N-Putty2 | LiPOLY N-putty2 is a silicone free tolerance filled, thermally conductive non-silicone putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our N-putty2 can replace thermals pads in design gaps of 0.1mm-1.0mm. N-putty2 has a bond line thickness of 100-1000μm. The thermal conductivity of the N-putty2 series is 5.0 W/m*K.

Features

  • Thermal conductivity: 5.0 W/m*K
  • Silicone free/tolerance filled
  • High compressibility with low stress
  • No vertical flow
  • High reliability
  • Bond Line Thickness: 100-1000μm

Applications

  • Notebook computers
  • Optical application
  • LED/TV hardware
  • Wireless communication hardware
  • High-speed mass storage drives
  • Set-top box
  • IP CAM

Do you have some questions? Please don’t hesitate to send us an email: projects@lipolytim.com