Two-Part Fast Curing Thermally Conductive Gel: PK223DM

Features

  • Thermal conductivity: 2.0 W/m*K
  • Fast curing in normal atmospheric temperatures
  • Great reliability
  • Great sealing in low-pressure applications

Applications

  • Between CPU and heatsink
  • Between any component and heatsink
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware

Two-Part Fast Curing Thermally Conductive Gel: PK700DM

Features

  • Thermal conductivity: 7.0 W/m*K
  • Fast curing in normal atmospheric temperatures
  • Great reliability
  • Great sealing in low-pressure applications

Applications

  • Between CPU and heatsink
  • Between any component and heatsink
  • Power supplies
  • High-speed mass storage drives
  • Telecommunication hardware