Non-Silicone Thermal Pad

Non-silicone thermal gap pads are designed for applications where silicone-based materials are not suitable, such as in environments where silicone contamination must be avoided. These pads offer similar thermal conductivity and flexibility but are made from alternative materials that eliminate the risk of outgassing or contamination.

Non-silicone pads are often used in sensitive electronics, optical devices, or cleanroom environments where maintaining purity is critical. They provide a clean, stable solution for thermal management without compromising on performance. Like their silicone counterparts, non-silicone pads can conform to irregular surfaces, ensuring efficient heat transfer and protecting components from overheating.

LiPOLY’s N series is silicone free resin material.  None low-molecular- weight siloxane volatilization cause no electrical contact failure.  It is suitable for optical products or sensitive electronic components.  Thermal conductivity: 1.5~17.0 W/m*K. Hardness Shore OO/50-60 has good thermal conductivity and exhibits the lowest thermal resistance value, especially the thermal conductivity of N800C is as high as 17.0 W/m*K.  Shiu Li has professional research and development capabilities which can provide cutting-edge thermal solutions immediately to meet all customers’ need for today’s advanced products.

What is low-molecular-weight siloxane?

The chemical formula indicates that the non-reactive cyclic polydimethylsiloxane Ho-[Si(CH3)2O]nH is volatile and volatilizes at any time. For example, when electronic products are in a closed space, the low volatile siloxane will cause obstacles to electrical contacts.