Non-Silicone Liquid Gap Fillers

Non-silicone liquid gap fillers are designed for applications where silicone-based materials may not be suitable, such as in environments that require low outgassing or where silicone contamination must be avoided. These fillers provide similar thermal conductivity and gap-filling capabilities but are made from alternative materials that eliminate the risks associated with silicone.

Non-silicone fillers are often used in cleanroom environments, optical devices, or other sensitive applications where purity is critical. These materials offer a stable and reliable thermal management solution without compromising performance. Like their silicone counterparts, non-silicone fillers are easy to apply and cure into a durable, thermally conductive interface that can handle mechanical stresses and thermal cycling.

What is Low-molecular-weight siloxane?

The chemical formula indicates that the non-reactive cyclic polydimethylsiloxane Ho-[Si(CH3)2O]nH is volatile and volatilizes at any time. For example, when electronic products are in a closed space, the low volatile siloxane will cause obstacles to electrical contacts.

Non-Silicone Thermal Conductive Putty

LiPOLY’s N-putty-s,N-putty2-s series is a non-silicon thermal conductive gel with thermal conductivity: 3.5-5.0W/m*K.  None low-molecular-weight siloxane volatilization causes no electrical contact failure.  It suitable use for optical products or sensitive electronic components. It has extremely low thermal resistance, low stress, flexible adaptation of the gap and tolerance compensation characteristics which can overcome overflow and dryness issue. Ideally suited for LiPOLY Smart Dispense Robot which is the best choice for automated dispensing production.

Non-Silicone Two-Part Thermal Conductive Adhesive

LiPOLY’s EPDM20-s,EPDM30-s series is silicone free two-part compound fixing glue, which have good fixing ability after curing at room temperature or high temperature. Compared with thermally conductive pad, non-silicon two-part thermal conductive adhesive not only produces low stress, high thermal conductivity, Low viscosity, while also maintains excellent insulation.  None low-molecular- weight siloxane volatilization cause no electrical contact failure.  It is suitable for optical products or sensitive electronic components.  Ideally suited for LiPOLY Smart Dispense Robot which is the best choice for automated dispensing production.

Non-Silicone Two-Part Thermal Conductive Sealing Glue

LiPOLY’s EP770-s series is silicon-free two-part compound that can be cured at room temperature or high temperature. The sealing glue is a liquid fluid thermally conductive adhesive that can fill the gaps in the air space around electronic devices. After curing, it will interact with heating electronic components and radiators, so that electronic products can run at high power for heat conduction. None low-molecular- weight siloxane volatilization cause no electrical contact failure. It is suitable for optical products or sensitive electronic components.

Non-Silicone Thermal Grease

LiPOLY’s N series is a non-silicon thermal grease with a thermal conductivity of 1.3-6.0W/m*K.  None low-molecular- weight siloxane volatilization cause no electrical contact failure.  It is suitable for optical products or sensitive electronic components. Extremely low thermal resistance and good thermal conductivity have been widely used in thermal control technology for consumer electronics and microprocessors. When the temperature of the component rises, the viscosity of the grease will decrease for wetting the interface components.