T-Work9000 is a type of thermal gap pad used for managing heat in electronic devices. Thermal gap pads, like T-Work9000, are designed to fill the gaps between heat-generating components and heat sinks, enhancing heat dissipation and improving device performance.
FEATURES
/ Thermal conductivity: 20.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
Table of Contents
T-work9000 Datasheet
Key Features of Thermal Gap Pads
- High Thermal Conductivity: These pads are designed to efficiently transfer heat away from components, reducing the risk of overheating.
- Flexibility and Conformability: Made from soft materials, thermal gap pads can conform to uneven surfaces and fill air gaps, which helps in reducing thermal resistance.
- Ease of Use: They are user-friendly; simply peel off the protective layer and place the pad between the component and the heat sink.
- Electrical Insulation: Many thermal gap pads provide electrical insulation, preventing short circuits between electronic components.
- Vibration Dampening: They also help in absorbing vibrations, reducing the risk of mechanical damage.
Advantages of Using T-Work9000
- Versatility: Suitable for various applications such as cooling CPUs, GPUs, memory modules, and power supplies.
- Durability: Designed to withstand high temperatures and maintain performance over time.
- Customization: Available in different thicknesses and sizes to meet specific application needs.
Applications
Thermal gap pads like T-Work9000 are widely used in electronics, telecommunications, automotive, medical devices, and more. They are particularly effective in applications where maintaining consistent thermal management is crucial for device reliability and longevity.
LiPOLY TIM Technology : Thermal Solutions