T-top81 Thermal Pad

by lipolytim

LiPOLY Top81 Thermal pads are thermal interface materials (TIMs) designed to enhance heat dissipation between electronic components and heat sinks. They are widely used in various industries, including electronics, telecommunications, automotive, and aerospace, due to their ability to efficiently manage heat and reduce thermal resistance.

LiPOLY T-top81 offers outstanding thermal conductivity at 8.0 W/m*K and extremely low thermal resistance under minimal force. T-top81 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.

FEATURES

/ Thermal conductivity: 8.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle

T-Top81 Datasheet

PDF Download Link 🔗

What Are Thermal Gap Pads?

Thermal gap pads are soft, conformable materials that fill the air gaps between heat-generating components and heat sinks. These pads help in reducing thermal resistance by providing a more efficient path for heat transfer. They are typically made from silicone or other polymers combined with thermally conductive fillers such as ceramic particles.

Key Features and Benefits:

  1. High Thermal Conductivity: Thermal gap pads are designed to provide excellent thermal conductivity, which helps in transferring heat away from critical components like CPUs and GPUs, preventing overheating.
  2. Conformability: These pads can easily conform to uneven surfaces and fill microscopic gaps, ensuring optimal contact between surfaces for improved heat transfer.
  3. Ease of Use: They are easy to handle and apply; users simply peel off the protective film and place the pad between the component and the heat sink.
  4. Electrical Insulation: Many thermal gap pads offer electrical insulation properties, preventing short circuits in electronic devices.
  5. Vibration Dampening: In addition to thermal management, these pads can absorb vibrations, reducing mechanical stress on components.

Applications

Thermal gap pads are used across a wide range of applications:

  • Electronics: Cooling for CPUs, GPUs, memory modules, and power supplies.
  • Automotive: Managing heat in control units and infotainment systems.
  • Telecommunications: Used in base stations and other high-power equipment.
  • Aerospace and Medical Devices: Ensuring reliable operation in critical systems.

Why Choose Thermal Gap Pads?

Thermal gap pads offer several advantages over other TIMs like thermal paste or putty:

  • Simplified Application: No need for precise application techniques; they can be easily placed without specialized tools.
  • Durability: They maintain performance over time without drying out or becoming less effective.
  • Customization: Available in various thicknesses and sizes to suit specific application needs.

LiPOLY TIM Technology : Thermal Solutions