Thermal Management

Thermal Tape🔗

Characteristics and Applications:

Thermal tape, also known as double-sided thermal adhesive tape, combines high thermal conductivity with strong adhesive properties. It is designed to fill gaps between heat sources and metal components, effectively dissipating heat generated by electronic products. Thermal tape is often reinforced with materials like glass fiber or polyimide to enhance its strength and dielectric breakdown voltage.

Advantages:

• Ease of Use: Thermal tape is easy to apply; simply cut to size, peel off the backing, and stick it onto the surfaces.
• Adhesive Functionality: It eliminates the need for mechanical fasteners like screws, simplifying assembly processes.
• Versatility: Suitable for small chips on motherboards, LED lamps, and other small electronic components.

Disadvantages:

• Limited Reusability: Once applied and removed, thermal tape generally cannot be reused.
• Adhesive Residue: Removal can sometimes leave adhesive residue on components.

Thermal Paste🔗

Characteristics and Applications:

Thermal paste, also known as thermal grease or compound, is a thermally conductive material used to fill air gaps between heat-generating components and heat sinks. It is particularly effective in maximizing heat transfer by filling microscopic imperfections on surfaces.

Advantages:

• High Thermal Conductivity: Offers superior heat transfer capabilities compared to other TIMs.
• Flexibility: Can be applied as a thin layer to conform to uneven surfaces, making it ideal for CPUs and GPUs.
• Cost-Effective: Generally less expensive than thermal pads.

Disadvantages:

• Application Complexity: Requires careful application to avoid mess and ensure even coverage.
• Maintenance: Can dry out over time, necessitating periodic reapplication.

Thermal Pads🔗

Characteristics and Applications:

Thermal pads are pre-formed solid materials that provide a consistent thickness for uniform pressure distribution between components. They are commonly used in applications where ease of use and electrical insulation are important.

Advantages:

• Ease of Installation: Pre-cut and easy to handle, reducing the risk of application errors.
• Electrical Insulation: Provides an added layer of protection by preventing electrical conductivity between components.
• Non-Drying: Unlike thermal paste, thermal pads do not dry out over time, offering a longer-term solution without frequent maintenance.

Disadvantages:

• Lower Thermal Conductivity: Typically offers less efficient heat transfer compared to high-quality thermal pastes.
• Single Use: Once removed, they cannot be reused and must be replaced with new pads.

Conclusion

Choosing between thermal tape, thermal paste, and thermal pads depends on specific application requirements:

• Thermal Tape is ideal for applications requiring both adhesion and heat dissipation without mechanical fasteners.
• Thermal Paste excels in high-performance scenarios where maximum heat transfer is needed but requires careful application.
• Thermal Pads offer simplicity and insulation benefits but may fall short in scenarios demanding high thermal conductivity.

Ultimately, the decision should be based on factors such as ease of use, thermal performance needs, electrical insulation requirements, and cost considerations. Each material has its strengths and weaknesses, making them suitable for different applications in electronic device manufacturing.

LiPOLY TIM Technology : Thermal Solutions

See the complete thermal datasheet by clicking here: Thermal GAP PAD

Silicone-Based Thermal Interface Materials

Silicone-based TIMs are widely used in electronics due to their excellent mechanical and thermal properties.

Key Features:

• Composed of silicone polymers (such as silicone oils or greases) mixed with fillers to enhance thermal conductivity
• High thermal stability over a wide temperature range
• Good adhesion to surfaces
• Low chemical reactivity
• Non-conductive with good thermal conductivity

Advantages:

• Excellent resilience against vibration and chemicals
• Superior performance in high-temperature environments
• Easy to apply and remove, suitable for applications requiring frequent maintenance or replacement

Disadvantages:

• Potential for outgassing, which may lead to contamination
• Higher cost compared to some alternatives

Silicone-Free Thermal Interface Materials

Silicone-free TIMs are formulations that do not contain silicone compounds, relying on other materials to achieve performance.

Key Features:

• Made from non-silicone polymers like acrylics, polyimides, metals, or ceramics
• Reduced outgassing tendencies
• Lower dielectric constant, offering better electrical insulation

Advantages:

• Suitable for applications requiring high electrical insulation
• Less risk of contamination in sensitive environments
• Can offer higher thermal conductivity than some silicone-based options

Disadvantages:

• May have lower mechanical flexibility compared to silicone-based TIMs
• Performance can vary significantly depending on the specific material composition

Choosing the Right Thermal Interface Material

When selecting between silicone-based and silicone-free TIMs, consider the following factors:

1. Thermal Conductivity: Silicone-based TIMs generally offer higher thermal conductivity.
2. Electrical Insulation: Silicone-free TIMs provide better electrical insulation due to lower conductivity.
3. Temperature Resistance: Silicone-based materials excel in high-temperature applications.
4. Outgassing Concerns: Choose silicone-free options if contamination is a concern.
5. Cost Considerations: Evaluate the long-term benefits against initial costs.
6. Application Requirements: Consider specific industry regulations or restrictions on silicone use.

Both silicone-based and silicone-free TIMs have their place in modern electronic thermal management. Silicone-based materials are ideal for high-temperature environments requiring robust mechanical properties, while silicone-free options are better suited for applications needing superior electrical insulation and reduced contamination risk.Carefully assess your application’s specific requirements to determine which type of TIM is most suitable for your needs.

LiPOLY TIM Technology : Thermal Solutions

See the complete thermal datasheet by clicking here: Thermal Grease
See the complete thermal datasheet by clicking here: Thermal GAP PAD

Characteristics of Thermal Grease

Thermal grease, also known as thermal paste, is a viscous compound typically made of silicone or ceramic-based materials mixed with thermally conductive fillers. Its main advantages include:

• Superior Thermal Conductivity: Thermal grease can fill microscopic air gaps, providing better heat transfer efficiency.
• High Adaptability: It easily conforms to irregular surfaces, ensuring maximum contact area.
• Thin Application: Can achieve ultra-thin bond lines of 10-20 microns, further reducing thermal resistance.

However, applying thermal grease requires some skill and may dry out or experience pump-out effects over time.

Characteristics of Thermal Pads

Thermal pads are pre-formed solid materials, usually made of silicone or other polymers, manufactured in specific shapes and thicknesses. Their key benefits include:

• Ease of Use: Can be quickly installed without special skills.
• Cleanliness: Less likely to make a mess compared to thermal grease.
• Reusability: Can often be reused multiple times in certain situations.
• Shock Absorption: Able to absorb vibrations, protecting sensitive components.

However, thermal pads generally have lower thermal conductivity compared to high-quality thermal grease and may not fully conform to surface irregularities.

Application Comparison

Choosing the Right TIM

Choose Thermal Grease: When you need optimal thermal performance and have the ability to apply it precisely. Ideal for high-performance CPUs, GPUs, etc.

Choose Thermal Pads: When ease of use and cleanliness are priorities, or when shock absorption is needed. Suitable for laptops, automotive electronics, etc.

Conclusion

Both thermal grease and thermal pads have their strengths and weaknesses. The choice depends on your specific application requirements. For scenarios demanding extremely high thermal performance, thermal grease might be the better option. In situations requiring quick, clean installation or shock absorption, thermal pads could be more suitable. Regardless of your choice, ensuring proper application is key to achieving optimal heat dissipation.

LiPOLY TIM Technology : Thermal Solutions

See the complete thermal datasheet by clicking here: Thermal Gel
See the complete thermal datasheet by clicking here: Thermal GAP PAD

Characteristics of Thermal Gel

Thermal Gel, also known as thermal encapsulation gel or thermal RTV gel, is a low-viscosity, flame-retardant, two-component silicone-based thermal encapsulation material.

Key features:

• Can cure at room temperature or with heat for accelerated curing
• Possesses certain adhesive properties
• Forms a rubber-like gel state after curing, which cannot be melted
• Thermal conductivity higher than Thermal Pad but lower than Thermal Paste (Thermal Grease)
• Difficult to separate bonded objects after curing
• Suitable for applications requiring one-time bonding

Characteristics of Thermal Pad

Thermal Pad is a pre-formed sheet of thermally conductive material designed to fill gaps between heat sources and heat sinks.

Key features:

• Thermal conductivity ranging from 0.8 to 15 W/m·K
• Available in various thicknesses and sizes
• Easy to install and replace
• Provides electrical insulation
• May offer shock absorption properties

Thermal Gel vs. Thermal Pad Comparison

1. Application Method:
   • Thermal Gel: Requires automatic dispensing machine, more resilient and less likely to dry out compared to grease.
   • Thermal Pad: Direct placement without additional processing
2. Curing Process:
   • Thermal Gel: Needs time to cure, forming a stable structure
   • Thermal Pad: No curing required, ready for immediate use
3. Thermal Performance:
   • Thermal Gel: Generally better than Thermal Pad, but may be lower than high-end thermal pastes
   • Thermal Pad: Good thermal performance, typically lower than liquid TIMs
4. Gap Filling Ability:
   • Thermal Gel: Excellent for filling irregular surfaces and microscopic gaps
   • Thermal Pad: Pre-formed shape may limit ability to fill highly irregular surfaces
5. Adhesive Properties:
   • Thermal Gel: Adhesive, difficult to separate after curing
   • Thermal Pad: Usually non-adhesive, easy to replace
6. Ease of Use:
   • Thermal Gel: Requires precise mixing and application, potentially more complex
   • Thermal Pad: Simple to use, suitable for mass production.

Selection Recommendations

Choosing between Thermal Gel and Thermal Pad depends on your specific application requirements:

• For filling complex shapes or providing additional adhesion, Thermal Gel might be the better choice.
• For applications requiring frequent maintenance or replacement, or in mass production scenarios prioritizing consistency and convenience, Thermal Pad may be more suitable.
• Consider thermal requirements, installation environment, maintenance frequency, and cost factors when making your final decision.

Regardless of the chosen solution, ensuring proper application and installation is crucial for achieving optimal thermal management and extending the lifespan of electronic devices.

LiPOLY TIM Technology : Thermal Solutions

Thermal Putty🔗

Characteristics:

• Moldability: Thermal putty is a soft, moldable material that can easily fill gaps and conform to uneven surfaces between heat sources and heat sinks. This flexibility makes it ideal for applications with high mechanical tolerances.
• Thermal Conductivity: It offers strong thermal conductivity and electrical insulation properties, maintaining performance over repeated heating and cooling cycles.
• Application: Thermal putty can be applied using dispensing machines, making it suitable for high-volume applications. It is particularly useful in scenarios where the exact thickness of the TIM needs to be adjusted on-site.

Advantages:

• Versatility: Its ability to conform to various shapes and fill gaps of different sizes makes it more versatile than pre-cut thermal pads.
• Cost-Effectiveness: Thermal putty can be more cost-effective over time due to its longevity and reduced need for replacement compared to thermal pads that may dry out or lose efficiency.
• Performance at High Temperatures: It retains its thermal properties better at higher temperatures compared to some thermal pads.

Thermal Pads🔗

Characteristics:

• Pre-Fabricated: Thermal pads are solid, pre-fabricated materials that come in various thicknesses and sizes. They are typically made from silicone or other flexible materials enhanced with thermally conductive fillers.
• Ease of Use: They are easy to install by simply peeling off a protective film and placing them between the heat source and sink.

Advantages:

• Simplicity: Easy to handle and apply without the mess associated with pastes or putties.
• Electrical Insulation: Provides good electrical insulation, making them suitable for electronic devices where voltage is present across the interface.

Disadvantages Compared to Putty:

• Limited Conformability: Thermal pads may not conform as well to irregular surfaces or fill gaps as effectively as thermal putty.
• Potential for Drying Out: Over time, thermal pads can dry out, reducing their effectiveness in heat transfer.
• Fixed Thickness: The pre-set thickness of thermal pads can be a limitation in applications requiring precise thickness adjustments.

Conclusion: Why Thermal Putty Wins

Thermal putty offers several advantages over thermal pads, particularly in applications requiring flexibility, high mechanical tolerance, and long-term reliability. Its ability to mold into various shapes and fill uneven gaps makes it a versatile choice for complex assemblies. Additionally, its cost-effectiveness and superior performance at high temperatures provide significant benefits in maintaining efficient heat dissipation over time.While thermal pads are easier to apply and provide good electrical insulation, their limitations in conformability and potential for drying out make them less suitable for applications demanding precise heat management solutions. Therefore, in scenarios where adaptability and long-term performance are critical, thermal putty emerges as the superior option.

LiPOLY TIM Technology : Thermal Solutions

See the complete thermal datasheet by clicking here: Liquid Gap Fillers

What is Thermal Putty?

Thermal putty is a soft, pliable material designed to fill gaps and provide thermal conductivity between heat-generating components and heat sinks. Its unique characteristics include:

Excellent Gap-Filling Ability: Thermal putty can easily conform to irregular surfaces and fill larger gaps, making it ideal for applications where components do not align perfectly.

High Compressibility: This material maintains its performance under stress without flowing vertically, ensuring reliable contact between surfaces.

Durability: Thermal putty is resistant to drying out, allowing it to maintain its thermal conductivity over extended periods without needing frequent reapplication.

What is Thermal Gel?

Thermal gel is a versatile TIM that combines the properties of both thermal paste and adhesive gels. It typically has a gel-like consistency that allows for easy application. Key features of thermal gel include:

User-Friendly Application: The gel consistency makes it easier to apply compared to traditional pastes, reducing the risk of air bubbles during application.

Non-Curing Properties: Unlike some adhesives, thermal gels remain soft and do not cure over time, making them long-term stability.

Good Thermal Conductivity: While generally offering lower conductivity than high-grade thermal pastes, thermal gels still provide adequate performance for many applications.

Comparing Applications

Choosing Between Thermal Putty and Thermal Gel

The decision between thermal putty and thermal gel depends on your specific application requirements:

Opt for Thermal Gel when ease of application is paramount, especially in mass production settings or when frequent maintenance is expected. Its user-friendly nature makes it a great choice for beginners or those looking for quick application methods.

Use Thermal Putty when you need a flexible solution that can accommodate larger gaps or uneven surfaces. It is particularly effective in environments where components may shift or vibrate, such as automotive or industrial applications.

Conclusion

Both thermal putty and thermal gel serve vital roles in managing heat in electronic devices. By understanding their differences, you can choose the right material that meets your performance requirements. Whether you prioritize gap-filling capability with thermal putty or the ease of application with thermal gel, making an informed choice will enhance the reliability and efficiency of your products.

LiPOLY TIM Technology : Thermal Solutions

See the complete thermal datasheet by clicking here: Liquid Gap Fillers

What is Thermal Grease?

Thermal Grease, also known as thermal paste, is a semi-fluid substance that helps to fill microscopic gaps between heat-generating components and heat sinks. Its primary function is to ensure a smooth transfer of heat by minimizing air gaps, which can impede thermal conductivity. Thermal grease is widely used in high-performance applications, such as in computers, telecommunications, and automotive electronics.

Key Benefits of Thermal Grease

High Thermal Conductivity: Designed for optimal heat dissipation, making it suitable for performance-critical environments.
Thin Application: Applied in a fine layer, reducing the possibility of material waste.
Requires Regular Maintenance: Over time, thermal grease can dry out and may need reapplication to maintain its effectiveness.

What is Thermal Putty?

Thermal putty, on the other hand, is a more malleable material that is designed to conform to irregular surfaces or large gaps between components. While it lacks the high thermal conductivity of thermal grease, its flexibility makes it ideal for applications where component alignment is imperfect, or larger gaps need to be filled.

Key Benefits of Thermal Putty:

Gap-Filling Capability: Unlike thermal grease, thermal putty can fill larger gaps more efficiently.
Less Frequent Maintenance: Thermal putty is generally more durable and stable over time, requiring less frequent reapplication.
Lower Thermal Conductivity: Typically, thermal putty doesn’t conduct heat as efficiently as thermal grease, but it still offers a reasonable solution for medium-performance applications.

Thermal Grease vs. Thermal Putty – Key Differences

To determine which material is better for your needs, it’s important to consider a few key differences:

Thermal Conductivity: Thermal grease typically offers higher thermal conductivity than thermal putty, making it the go-to solution for high-performance electronic devices.
Application: Thermal grease requires careful, thin application to prevent leakage and ensure even heat transfer. Thermal putty, however, is easier to apply and is more forgiving of uneven surfaces.
Durability: While thermal grease may dry out and degrade over time, thermal putty is more stable, lasting longer without the need for reapplication.
Gap Size: Thermal putty is better suited for situations where there is a larger gap between components, while thermal grease is ideal for tightly fitted surfaces.

Which Should You Choose?

Choose Thermal Grease: If you are dealing with high-performance electronics, such as CPUs, GPUs, or other heat-critical components that require excellent thermal conductivity and precision application.

Choose Thermal Putty: If your application involves larger gaps, uneven surfaces, or less critical thermal management needs. It offers a more durable, maintenance-free solution for medium-performance systems.

Conclusion

In conclusion, both thermal grease and thermal putty serve vital roles in thermal management, but their applications vary based on specific needs. For performance-critical environments where heat dissipation is paramount, thermal grease offers superior thermal conductivity. Meanwhile, thermal putty provides a more flexible, long-lasting solution for filling larger gaps in less demanding settings.

LiPOLY TIM Technology : Thermal Solutions

Apple and Samsung have taken different approaches to solving overheating issues in their smartphones. With the release of the iPhone 16, Apple opted for Graphene thermal pads, while Samsung continues to use the vapor chamber cooling system in its devices. So, why did Apple choose graphene sheets over the more complex vapor chamber solution? The reasons lie in cost, size, weight, and efficiency.

See the complete thermal datasheet by clicking here: Graphite Sheets

The Advantages of Graphene Sheets

1. Lower Cost and Smaller Size

Graphene thermal pads offer a significant advantage in terms of cost. Graphene is relatively inexpensive to produce compared to vapor chambers, making it a more economical option for mass production. Additionally, graphene sheets are incredibly thin and lightweight, allowing Apple to save valuable internal space in the iPhone, which is critical for small, lightweight devices like smartphones.

2. Lightweight and Flexible

In comparison to vapor chambers, graphene sheets are much lighter. In mobile devices, every gram matters. The external casing of the iPhone acts as the primary heat sink, as it is in direct contact with the cool external air, which helps dissipate heat. Using a bulky vapor chamber inside a smartphone is unnecessary when the casing already plays a major role in cooling. Additionally, graphene sheets are flexible and can be easily molded or cut into various shapes, allowing them to fit seamlessly into the complex internal structure of modern smartphones.

3. Electromagnetic Shielding

One of the key benefits of graphene thermal pads is their ability to provide electromagnetic shielding. Not only do they conduct heat effectively, but they also reduce electromagnetic interference between internal components. This dual function enhances the overall stability and performance of the iPhone.

The Drawbacks of Vapor Chambers

1. Reliance on Thermal Interface Materials (TIM)

Vapor chambers require additional thermal interface materials (TIM) to transfer heat from the chip to the heat sink. This adds complexity and cost to the cooling system, as more components are needed to ensure effective heat dissipation. In contrast, graphene thermal pads combine the functions of a heat sink and thermal interface, simplifying the overall design while maintaining efficient heat transfer.

2. High Cost and Overengineering

While vapor chambers can provide high levels of cooling efficiency, they come with a higher price tag and may be considered over-engineered for smartphones. In lightweight mobile devices like smartphones, the external casing is primarily responsible for dissipating heat by making contact with cool air. Installing a high-cost vapor chamber inside the device may not significantly improve performance compared to more affordable and efficient alternatives like graphene thermal pads.

Graphene vs. Vapor Chamber: A Closer Comparison

UTVC vs. Graphene

Samsung has also been developing Ultra-Thin Vapor Chamber (UTVC) technology, which offers even better heat transfer than traditional graphite. However, when compared to graphene, UTVC still falls short in some key areas. Graphene is thinner, lighter, and cheaper, making it ideal for smartphones where every millimeter counts. It can be used in spaces as under 0.25mm, making it a superior choice for compact devices like the iPhone.

Conclusion: Why Apple Chose Graphene

Apple’s decision to use Graphene sheets over vapor chambers in the iPhone comes down to practicality. For lightweight mobile devices, graphene offers a more cost-effective, flexible, and space-efficient solution. The material’s excellent thermal conductivity, combined with its ability to provide electromagnetic shielding, makes it an ideal choice for smartphone cooling systems. While vapor chambers, particularly advanced versions like UTVC, can outperform graphite in some areas, they are often over-engineered and less suited for the slim, compact designs of modern smartphones.

In the future, we may see further advancements in graphene technology, which could solidify its position as the go-to material for thermal management in electronics, leaving heavier and more expensive solutions like vapor chambers behind.

As Apple continues to refine its product designs, Graphene Thermal pads offer a forward-looking solution for managing heat in the next generation of mobile devices, ensuring that users can enjoy high-performance smartphones without the risk of overheating or sacrificing sleek, lightweight designs.

LiPOLY TIM Technology : Thermal Solutions

See the complete thermal datasheet by clicking here: Graphite Sheets

What is Graphene?

Graphene is a single layer of carbon atoms arranged in a two-dimensional honeycomb lattice. It is one of the thinnest yet strongest materials known, with remarkable electrical and thermal conductivity. Due to its unique structure, graphene is considered a revolutionary material for various applications, from electronics to energy storage.

What is Graphite?

On the other hand, graphite is a naturally occurring form of carbon consisting of many layers of graphene stacked on top of each other. It is widely used in everyday products like pencils and batteries, where its lubricating properties and conductivity are valuable. However, due to its multilayered structure, graphite doesn’t possess the same level of conductivity or strength as graphene.

Why Graphene is Replacing Graphite in Technology

Graphene’s superior properties make it ideal for modern technological applications. From enhancing thermal management systems in smartphones like the iPhone 16 to enabling faster charging and longer battery life, graphene is becoming a game-changing material. Graphite, while still useful in traditional applications, cannot match the performance of graphene in advanced tech sectors.

In summary, while graphite remains a valuable material, graphene is taking the lead in high-tech industries, offering unprecedented benefits in conductivity, strength, and flexibility.

Advanced Thermal System

One of the key improvements in the iPhone 16 Pro is its enhanced thermal management. Leaked images suggest that Apple has moved away from the traditional lighter foil coverings on battery casings in favor of a more heat-resistant metal material. This upgrade is designed to improve the phone’s ability to handle heat more effectively, especially during intense activities like gaming, video editing, or prolonged multitasking sessions.

Graphene Thermal System and the Graphene Sheet

A standout feature in the iPhone 16 Pro is the introduction of the graphene thermal system, which includes replacing the existing graphite pads with a graphene sheet. Graphene, a material known for its exceptional thermal conductivity, offers substantial improvements in managing heat. By swapping out graphite pads for graphene sheets, the iPhone 16 Pro gains a significant advantage in dissipating heat more efficiently, ensuring that the device remains cooler even during heavy usage.

Why Thermal Management Matters

Improving thermal management in smartphones is crucial for both performance and longevity. Devices that overheat often suffer from throttled performance, reduced battery life, and can even experience hardware damage over time. With the iPhone 16 Pro’s graphene sheet integrated into the thermal system, users can expect better heat dissipation, resulting in a smoother user experience and more reliable device operation over the long term.

LiPOLY TIM Technology : Thermal Solutions