Silicone Lightweight Thermal Interface Materials

Silicone-based TIMs are among the most commonly used materials in the industry, known for their excellent thermal performance, flexibility, and reliability.

Lightweight Thermal Conductive Gel Pad

LiPOLY’s DTT44-s/DTT65-s series is a low-density thermal pad. Its low density and lightweight characteristics enhance product performance, reduce production costs, and minimize material usage and energy consumption. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of 3.0-5.0 W/m*K. Specifically designed for network communication signal transmission, it focuses on reducing interference in RF modules with optimized Dk and Df properties. With a Shore OO hardness of 50-55, it offers flexibility, compressibility, insulation, and excellent self-adhesion. It can fill positive and negative tolerances in mechanical designs, demonstrating high stability, and can be customized in cut and shape.

Silicone Lightweight Thermal Interface Putty

LiPOLY’s DTT04-s/DTT06-s/DTT10-s series is a low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs, and minimize material usage and energy consumption. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of 4.0-10.0 W/m*K. It features high deformability, flexible gap adaptation, and tolerance compensation. The material overcomes overflow and drying issues, improves thermal conduction, and is suitable for automated dispensing production.

Lightweight Two-Part Thermal Conductive Sealing Glue

LiPOLY’s TPS series is a low-density, two-component potting material. Its low density and lightweight properties enhance product performance, reduce production costs, and decrease material usage and energy consumption. It is commonly used in electronic products and automotive electronic equipment. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. As a thermally conductive adhesive with liquid flow properties, it can fill the gaps in the air space around electronic devices, maintaining close contact with heat-generating electronic components and heat sinks after curing, allowing electronic products to conduct heat efficiently under high power operation.