Non-Silicone Lightweight Thermal Conductive Putty

 LiPOLY’s NL-putty series is a non-silicone, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs, and minimize material usage and energy consumption. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of 4.0-10.0 W/m*K. The non-silicone property ensures no volatilization of low-molecular-weight siloxane, preventing electrical contact failures. It features high deformability, flexible gap adaptation, and tolerance compensation. The material overcomes overflow and drying issues, improves thermal conduction, and is suitable for automated dispensing production.

 What is Low-molecular-weight siloxane?

 The chemical formula indicates that the non-reactive cyclic polydimethylsiloxane Ho-[Si(CH3)2O]nH is volatile and volatilizes at any time. For example, when electronic products are in a closed space, the low volatile siloxane will cause obstacles to electrical contacts.

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