Thermal Conductive Putty

LiPOLY’s Putty Series is gap filler material with a thermal conductivity 3.5~8.0W/m*K, high deformation amount, extremely low thermal resistance, low stress, flexible gap adaptation, and excellent tolerance compensation feature can overcome overflow and dryness problems.  Ideally suited for LiPOLY Smart Dispense Robot which is the best choice for automated dispensing production.

Two-Part Thermal Conductive Gap Filler

LiPOLY’s DM series is two-part compound gap filler that can be cured at room temperature or high temperature. Compared with thermally conductive pad, the Two-Part Thermal conductive Gap filler not only produces low stress, high thermal conductivity, and low viscosity on the components, but also maintains insulation properties.  Thermal conductivity: 2.2~7.0W/m*K.  Ideally suited for LiPOLY Smart Dispense Robot which is the best choice for automated dispensing production.

Two-Part Thermal Conductive Sealing Glue

LiPOLY’s TPS series is a two-part compound sealing glue that can be cured at room temperature or high temperature. The sealing glue is a liquid fluid thermally conductive adhesive that can fill the gaps in the air space around electronic devices. After curing, it will interact with heating electronic components and radiators, so that electronic products can run at high power for heat conduction.  It’s a nice gap filler material with thermal conductivity 0.8~2.0W/m*K.

Two-Part Curable Thermal Grease

LiPOLY’s D2000 is a two-part compound thermal grease that can be cured at room temperature or high temperature. It’s properties of extremely low thermal resistance and high reliability cause no dryness and overflow.

Thermal Grease

LiPOLY’s G and TT series is thermal grease with extremely low thermal resistance and good thermal conductivity features. They have been widely used in thermal control technology for consumer electronics and microprocessors. When the temperature of the components rises the viscosity of the grease will decrease for wetting interface element. Thermal conductivity: 1.3-6.0W/m*K, it’s a nice gap filler material.

Thermal Conductive Die Attach Adhesive

LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent TIM 1 Material with Thermal conductivity 2.0- 4.0W/m*K. Ideally suitable for automated dispensing operations.

Do you have some questions? Please don’t hesitate to send us an email: service_us@lipoly.com