EP770 Thermal Conductive Gel

by lipolytim

The EP770 Non-Silicone Thermal Conductive Gel by LiPOLY® is a high-performance thermal gap filler designed for effective heat dissipation in various applications. This silicone-free, two-part sealing gap filler is particularly suitable for environments where low molecular siloxane volatilization is a concern.

The EP770 Non-Silicone Thermal Grease by LiPOLY® is a high-performance thermal gap filler designed for effective heat dissipation in various applications. This silicone-free, two-part sealing gap filler is particularly suitable for environments where low molecular siloxane volatilization is a concern. Here’s a detailed overview of its features, applications, and benefits:

FEATURES

/ Thermal conductivity: 2.5 W/m*K
/ Thermally conductive vibration dampening
/ Low mixing viscosity
/ Extremely low Shrinkage rate 0.01%.
/ Epoxy Based material with high hardness for support
/ Slow sedimentation rate due to Resin & powder mixing perfectly via superb processing technology. It leads EP770 material easy to mix and disperse.

TYPICAL APPLICATION

/Motor: Torque motor、Linear Motor Servo motor
/IGBT module
/Electronic components: IC、CPU MOS、Mother Board
/Wireless Hub
/Automotive electronics
/Between any heat-generating component and a heat sink
/5G base station & infrastructure
/ EV electric vehicle

EP770 Datasheet

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The EP770 Non-Silicone Thermal Conductive Gel by LiPOLY® is a high-performance thermal gap filler designed for effective heat dissipation in various applications. This silicone-free, two-part sealing gap filler is particularly suitable for environments where low molecular siloxane volatilization is a concern. Thermal management World Leader : LiPOLY TIMs®

Key Features of EP770 Thermal Gel

  1. Thermal Conductivity: With a thermal conductivity of 2.5 W/m*K, EP770 provides excellent heat transfer capabilities, making it ideal for high-performance electronic components.
  2. Low Viscosity and High Fluidity: The gel offers low mixing viscosity and high fluidity, allowing it to fill gaps closely and cover design tolerances effectively.
  3. High Insulating Properties: EP770 is highly insulating, providing electrical insulation, which is crucial in preventing short circuits.
  4. Low Shrinkage Rate: The material exhibits an extremely low shrinkage rate of 0.01%, ensuring stability and longevity in its applications.
  5. Epoxy-Based Material: Its epoxy base provides high hardness and support, making it robust for various industrial uses.
  6. Customizable: Available in tinplate cans (1 kg) and other special sizes upon request, allowing for flexibility in different applications.

Typical Applications

  • Motors: Suitable for torque motors, linear motors, and servo motors.
  • IGBT Modules: Ensures efficient thermal management in power modules.
  • Electronic Components: Ideal for ICs, CPUs, MOSFETs, and motherboards.
  • Automotive Electronics: Used in automotive control units to manage heat effectively.
  • 5G Base Stations and Electric Vehicles (EVs): Supports advanced communication infrastructure and EV systems by maintaining optimal operating temperatures.

Preservation and Usage

  • The product can be preserved for up to 24 months when stored unopened at room temperature (25°C).
  • For better extrusion and mixing at ambient temperatures below 25°C, preheating the material to 40°C for 20 minutes or 50°C for 10 minutes is recommended.

Conclusion

The EP770 Non-Silicone Thermal Gel by LiPOLY® offers a reliable solution for thermal management in various high-demand applications. Its combination of excellent thermal conductivity, low viscosity, and high insulating properties makes it an ideal choice for industries ranging from electronics to automotive manufacturing.

LiPOLY TIM Technology : Thermal Solutions