High Thermal Conductive Gap Filler

LiPOLY’s T series is an extremely high-performance thermally conductive pad, with excellent insulation, compressibility, and soft characteristics that can fill gaps exhibit a very low thermal resistance effect. They can be customized die-cut and shape molding.  Shiu Li has professional research and development capabilities which can provide cutting-edge thermal solutions immediately to meet all customers’ need for today’s advanced products.

Thermal Conductive Gel Pad

LiPOLY’s PK series is an excellent gap filler material with thermal conductivity 2.0~7.0 W / m*K.  The hardness is Shore OO/30-50 with high flexibility, high compressibility, high insulating, great self-adhesive, which can remove manufacturing tolerances. Customized die-cut and shape molding are all available.

Exceptionally Soft Thermal Conductive Gel Pad

LiPOLY’s BS series is an ultra-soft thermally conductive gel pad with high resilience characteristics which can avoid the deformation of PCB and other components caused by assembly stress. Thermal conductivity: 3.0~5.0W / m*K and hardness Shore OO/10-25 provide high flexibility, high compressibility, high insulation and good self-adhesiveness. It can cover the tolerance of design making it very stable, also can offer customized die-cut & shape molding service.

Ultra Low Oil-Bleed Thermal Conductive Gel Pad

LiPOLY’s AS series has low oil-bleeding characteristics under high compression which can prevent the product from polluting electronic components due to silicon oil seepage, or combining with dust in the environment, causing dirt and affecting product appearance.  It’s a best choice of gap filler material with thermal conductivity: 2.0~4.0W/m*K.  Hardness Shore OO/30~40 provides flexibility, compressibility and insulation.  Shiu Li has professional research and development capabilities which can provide cutting-edge thermal solutions immediately to meet all customers’ need for today’s advanced products.