PK223 Thermal Pad

by lipolytim

The PK223 Thermal Conductive Pad by LiPOLY® is a specialized thermal interface material designed for gap filling and effective heat dissipation in electronic devices. It offers a thermal conductivity of 2.0 W/m*K, making it suitable for a wide range of applications where efficient thermal management is crucial.

ShiuLi-Thermal Conductive Gel Pad

FEATURES

/Thermal conductivity: 2.0 W/m*K
/ Naturally tacky for ease of manufacture
/ Low thermal impedance
/ Available in a range of thicknesses

TYPICAL APPLICATION

/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL APPLICATION

/ Roll form
/ Sheet form
/ Die-cut parts

PK223 Datasheet

PDF Download Link 🔗

Key Features of PK223 Thermal Conductive Pad

  1. Thermal Conductivity: With a thermal conductivity of 2.0 W/m*K, the PK223 pad efficiently transfers heat from electronic components to heat sinks, preventing overheating.
  2. Flexibility and Compressibility: The pad has a Shore OO hardness of 30, providing high flexibility and compressibility. This allows it to conform to uneven surfaces, ensuring optimal contact and heat transfer.
  3. Insulating and Self-Adhesive Properties: The PK223 is highly insulating and naturally tacky, simplifying the manufacturing process by eliminating the need for additional adhesives.
  4. Customization: LiPOLY® offers customized shape molding services, allowing the pad to be tailored to specific design requirements.

LiPOLY® PK223 Thermal Conductive Pad is a specialized thermal interface material designed for gap filling and effective heat dissipation in electronic devices. It offers a thermal conductivity of 2.0 W/m*K, making it suitable for a wide range of applications where efficient thermal management is crucial.

Typical Applications

  • Notebook Computers: Enhances cooling efficiency in compact laptop designs.
  • Heat Pipe Assemblies: Improves thermal management in complex cooling systems.
  • Memory Modules and TV Hardware: Ensures stable operation by managing heat in memory and display components.
  • Automotive Electronics and Mobile Devices: Provides reliable thermal management in automotive control units and smartphones.
  • 5G Base Stations and EVs: Supports advanced communication infrastructure and electric vehicles by maintaining optimal operating temperatures.

Specifications

Available in roll form, sheet form, and die-cut parts to suit various application needs.

Conclusion

The PK223 Thermal Conductive Pad by LiPOLY® is an excellent choice for applications requiring efficient heat dissipation and gap filling. Its combination of high thermal conductivity, flexibility, and ease of use makes it ideal for modern electronic devices across multiple industries.

LiPOLY TIM Technology : Thermal Solutions