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Thermal Conductive Liquid Gap Filler – SH-putty3

LiPOLY SH-putty3 is a one-part thermally conductive putty that offers outstanding thermal conductivity at 8 W/m*K and extremely low thermal resistance under minimal pressure. SH-putty3 is a highly conformable gap filler, designed to replace gap pads and remove manufacturing tolerance. It’s ideally suited for mass production applications in which a dispensing robot is needed.

See the complete thermal datasheet by clicking here: SH-putty3

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Thermally Conductive Gap Pad

LiPOLY’s R&D team have created an ultra-soft, highly conformable, non-flammable interface material. LiPOLY T-Top 800 is a high deflection material, designed to allow minimal stress on components while offering high thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-Top 800 offers excellent performance at an extremely competitive price.

See the complete thermal datasheet by visiting: T-Top 800

Thermally Conductive Gap Filler