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Thermal Conductive Liquid Gap Filler – SH-putty3

LiPOLY SH-putty3 is a one-part thermally conductive putty that offers outstanding thermal conductivity at 8 W/m*K and extremely low thermal resistance under minimal pressure. SH-putty3 is a highly conformable gap filler, designed to replace gap pads and remove manufacturing tolerance. It’s ideally suited for mass production applications in which a dispensing robot is needed.

See the complete thermal datasheet by clicking here: SH-putty3

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New High-Performance Nano-Thermal Interface Grease

LiPOLY TT3000 is a highly reliable thermal interface grease made of solvent-free silicone oil compounds and thermal fillers. TT3000 provides superior performance and reliability while mitigating against pump-out and floating issues on the interface. TT3000 improves the operating process while simultaneously providing high thermal conductivity and excellent low thermal resistance. This material will handle the most demanding of applications. 

See the complete thermal datasheet by clicking here: TT3000

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Thermally Conductive Gap Pad

LiPOLY’s R&D team have created an ultra-soft, highly conformable, non-flammable interface material. LiPOLY T-Top 800 is a high deflection material, designed to allow minimal stress on components while offering high thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-Top 800 offers excellent performance at an extremely competitive price.

See the complete thermal datasheet by visiting: T-Top 800

Thermally Conductive Gap Filler

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Thermally Conductive Putty

Shiu Li Technology has created a new advanced thermal interface material. LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the H-putty series is 2.0/3.5/6.0 W/m*K.

 

See the complete thermal datasheet by visiting: H-Putty

Thermal Solutions S-putty compound