by lipolytim lipolytim

Thermal Conductive Liquid Gap Filler – SH-putty3

LiPOLY SH-putty3 is a one-part thermally conductive putty that offers outstanding thermal conductivity at 8 W/m*K and extremely low thermal resistance under minimal pressure. SH-putty3 is a highly conformable gap filler, designed to replace gap pads and remove manufacturing tolerance. It’s ideally suited for mass production applications in which a dispensing robot is needed.

See the complete thermal datasheet by clicking here: SH-putty3

by Lipoly Admin Lipoly Admin

Thermally Conductive Putty

Shiu Li Technology has created a new advanced thermal interface material. LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the H-putty series is 2.0/3.5/6.0 W/m*K.


See the complete thermal datasheet by visiting: H-Putty

Thermal Solutions S-putty compound